By Geoff Giordano For the first time, presentations at the Laser Institute of America’s 33rd International Congress on Applications of Lasers & Electro-Optics (ICALEO®) will undergo a peer-review process that will bring even more scholarly rigor to the cutting-edge research presented at the conference. “It’s my second year as general chair, but there have been […]
Month: October 2014
The Novel Technology for Thick Glass Cutting with Small Power Laser Saw
By Chao Huang, Jimin Chen and Shi bai Introduction In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In […]
High Density Through Glass Vias for Advanced Chip Packaging
By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative […]
Make Vital Laser Hazard Analysis Calculations with the Evaluator
Orlando, FL (Oct. 1, 2014) – Are you an overworked laser safety officer (LSO) in a high-pressure commercial or research facility? Need to make vital hazard analysis calculations on the fly? Look no further than the Evaluator — the Laser Institute of America’s industry-first web-based system that helps you quickly and easily ensure a laser-safe environment. […]