By Geoff Giordano Sapphire cutting for electronic displays, laser marking and processes related to retrieving and transporting oil, were among the leading applications spotlighted at LIA’s fourth Lasers for Manufacturing Event® (LME®) on Sept. 23-24 at the Schaumburg (IL) Convention Center. Attendees packed 101-level courses on laser types, laser welding, cost advantages of lasers and […]
Month: October 2014
Introduction to Laser Micromanufacturing
By Ronald D. Schaeffer Laser micromanufacturing is just like traditional manufacturing except that we use photons (light!) instead of, for instance, drill bits and saw blades. Lasers are used for machining, marking, welding and surface treatment. This article provides a brief summary of how lasers are used in several exemplary situations. In conclusion, a discussion […]
Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
By Christian Fornaroli Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but […]
LIA Today September/October edition available online!
The latest LIA Today has been published and is now available online. If you have never read LIA Today we encourage you to flip open a few pages! Those of you who have read it in the past know what a great publication this is.If you would like to take a look you can find […]
What You Missed at LIA’s Lasers for Manufacturing Event and Summit 2014
ORLANDO, FL, Oct. 17, 2014 — The fourth annual LME was another exciting event full of informative educational courses and laser vendors with offerings on a wide range of laser related products. Laser experts, business professionals and representatives of the industry curious about laser manufacturing gathered for LME 2014 at the Schaumburg Convention […]