Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process

By Christian Fornaroli Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but […]

Read more