The latest LIA Today has been published and is now available online. If you have never read LIA Today we encourage you to flip open a few pages! Those of you who have read it in the past know what a great publication this is.If you would like to take a look you can find […]
Author: Steven Glover
Steven Glover is a proud member of the LIA staff. When he is not at work he is actively involved in several charitable efforts.What You Missed at LIA’s Lasers for Manufacturing Event and Summit 2014
ORLANDO, FL, Oct. 17, 2014 — The fourth annual LME was another exciting event full of informative educational courses and laser vendors with offerings on a wide range of laser related products. Laser experts, business professionals and representatives of the industry curious about laser manufacturing gathered for LME 2014 at the Schaumburg Convention […]
ICALEO 2014: The Premier Conference for World-Class Laser Research
By Geoff Giordano For the first time, presentations at the Laser Institute of America’s 33rd International Congress on Applications of Lasers & Electro-Optics (ICALEO®) will undergo a peer-review process that will bring even more scholarly rigor to the cutting-edge research presented at the conference. “It’s my second year as general chair, but there have been […]
The Novel Technology for Thick Glass Cutting with Small Power Laser Saw
By Chao Huang, Jimin Chen and Shi bai Introduction In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In […]
High Density Through Glass Vias for Advanced Chip Packaging
By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative […]