Laser Applications in the Automotive Industry

By: Klaus Loeffler

TRUMPF Laser und Systemtechnik GmbH, Ditzingen, Germany

The automotive industry has been a target market for the laser soon after the invention of the laser in 1960. Mass production and flexibility have been the arguments for the laser. The first installations in 1973 all the way to late 1980 have been successful due to the missing industrial ready laser resonators. But the laser has seen a fast development over the years and with it the use of lasers in the automotive industry.

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Laser Scribing of Stainless Steel with and without Work Media

By: Anna Unt, Heidi Piili, Marika Hirvimäki, Matti Manninen, Antti Salminen

Lappeenranta University of Technology, Laser Processing Technology Research Group, Finland
Machine Technology Centre Turku Ltd, Finland

Improving control and decreasing energy needs have been the most addressed problems of chemical industry in recent years. One of the thoroughly researched options has been bringing down the scale of production units. Productivity comparable with large-scale industrial mechanisms can be reached by grouping simultaneously working milli-scale production units with volumes of few ml/min having reaction channels with length of 1-100 mm, width of 0.5-2 mm and depth of 0.25-2 mm. The use of milliscale devices has been limited due to the lack of cost-efficient production method, manufacturing such channels by laser can give savings on cost and simplify the production cycle.

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Real-Time Control of Polarization in High-Aspect-Ratio Ultra-Short-Pulse Laser Micro-Machining

By: O. J. Allegre, W. Perrie, K. Bauchert, G. Dearden, K. G. Watkins

Laser Group, School of Engineering, University of Liverpool, UK
Boulder Nonlinear Systems, Inc., Colorado

The past decade has seen the development of ultra-short pulse lasers, with processes based on femtosecond and picosecond pulse durations becoming increasingly widespread. Thanks to the ultra-short timescale on which laser energy is coupled to the material, high precision machining of metals has been achieved with very little thermal damage. Industrial applications include the very precise drilling of holes for fuel-injection nozzles in the automotive industry. Polarization plays a particularly important role in drilling high-aspect-ratio (depth/diameter) microscopic holes in metal. Drilling with a linear polarized laser beam produces distorted hole profiles due to the anisotropic reflectivity of linear polarization. This paper describes the use of a liquid-crystal polarization rotator developed by Boulder Nonlinear Systems, Inc. to improve drilling quality by removing the distortions associated with static linear polarization. This flexible device allows rapid switching of the linear polarization of a laser beam between two orthogonal directions during micro-drilling. As a proof of principle, helical drilling tests were performed on stainless steel, using a 775 nm, 200 femtosecond pulse laser.

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Laser cutting of paper materials

By: Heidi Piili

Laser cutting of paper materials

1          Introduction

It is known that CO2 laser beam is suitable for cutting of paper materials. Laser technology has been applied to paper cutting since 1970’s. Mainly the application of laser technology are in paper slitting applications, even though paper materials can be laser cut with high cutting speeds and with good quality (see figure 1). [1, 2, 3]

a)                                   b)

Figure 1. Example of laser cut paper material products: (a) laser cut DVD package and (b) laser cut double-CD-package. [5]

The combination of laser an paper has been studied over 30 years, but still implementation of laser technology in the paper industry has remained limited. This situation changed in 1990´s: laser equipments were cheaper, improved lasers were developed and the laser technology became more reliable. [3, 4, 5]

2          Basic principle

When a laser beam with high energy intensity hits paper, material is heated and it decomposes chemically. Degradation products are evaporated or removed from cut kerf by cutting gas jet. A cut kerf is formed, when cutting head is removed in relation to work piece. [6, 7, 8] Figure 2 shows the basic mechanism of laser cutting of paper materials.

Figure 2. Basic mechanism of laser cutting of paper materials. [9]

3          Cutting mechanism

Cutting mechanism in laser cutting of paper materials is vaporisation cutting. This mechanism means a cutting method where laser beam heats up the material top surface to evaporation temperature or to temperature where chemical degradation happens. [8, 10] Usually inert cutting gas (like nitrogen) is used to prevent combustion of vaporised material. [6, 8]

4          Cutting processes in paper making

In paper/board making process there are several needs for cutting, like

–     edge trimming of web ,

–     cross-machine direction cutting of web,

–     slitting of web to customer width,

–     sheeting of web,

–     cutting of package blanks etc.

Paper/board making and converting industry needs high-capacity machines. Conventionally cutting of fibre material is done by mechanical blades or die-cutting. In 80´s water jet became as a competitive cutting method. [5]

In laser cutting studies of paper materials carried out in Lappeenranta Laser Processing Centre (LLPC) it has been found that a magazine paper can be cut with laser beam at speed of 4400 m/min. This speed totally fulfils the requirements of papermaking process. [11]

Laser cutting technology can be combined with digital printers. Conventionally paper materials have been printed with rotogravure or offset method. When these printing methods are used, batch sizes usually are large and each change in print image needs a special modification to print tool. Advantage of digital printing is that even very small batch sizes can be printed easily and change in print image is only question about programming. Laser cutting could provide also as on-line cutter further flexibility to whole printing process. A change in cutting pattern is only question of programming and no new cutting tool is needed. [12]

Generally it can be said that laser cutting in cutting of paper materials is recommended in following circumstances [5]:

–     wherever production size is small or constantly below 1000 pieces.

–     always with digital printing.

–     when high accuracy with complex geometries is needed.

–     when flexible production and fast delivery is needed.

–     when tailor-made products are needed.

5          Advantages and disadvantages of laser cutting

When paper/board is cut with conventional mechanical blades there are several problems, which make the cutting quality bad or even destroy it. A big problem in mechanical cutting of fibre material is dust which consists of piece of fibres and pigment particles ripped out of paper by cutting blades. This dust causes for example runnability problems in printing houses. Also in many cases coarse cut edge which contains out-sticking fibre endings causes many problems. For example in liquid packaging industry such a problem is not wanted because liquid absorption properties of cut edge are very important (see figure 3). [6, 8, 13]

a)                                                b)

Figure 3. Scanning electron microscopy (SEM) images of (a) laser cut edge and (b) mechanically cut edge. [13]

Technically, laser cutting of paper/board is possible and the cut kerf quality is very good. Also the amount of dust released during laser cutting is much lower than with mechanical or water jet cutting. The most important advantage of laser technology is its flexibility where batch sizes of one piece to ten thousand pieces can be accomplished. [13]

6        References:

[1]       Anon., Cutting it fine, Paper, vol. 217, 1992 no. 5, p. 38.

[2]       Anon., Laser – soveltuuko puuntyöstöön?, Paperi ja Puu, vol. 68, 1986, no. 10, pp. 694-696.

[3]       Malmberg, H., Characterisation of laser cutting of consumer boards, Master of Science Thesis, Lappeenranta University of Technology, 2003, 181 p.

[4]       Schable, R., Changing slitting methods, Paper, film & foil converter, vol. 67, 1993, 9, pp. 82-83.

[5]       Malmberg, H., Immonen, M.; Kujanpää, V., Laser cutting of paper, Proceedings of Challenges´06 Symposium, 8.-10.11.2006, Bratislava, Slovakia, 32 p.

[6]       Federle, H., Keller, S., Papierschneiden mit Laser (Teil 1), Papier+Kunststoff+Verarbeiter, vol. 27, 1992, no. 7, pp. 32-39.

[7]       Rickli, M., Alternative Schneidtechniken für Papier, Diploma Papier, Lausanne, 1982.

[8]       Malmberg, H., Kujanpää V., Paperimateriaalien laserleikkaus on tulevaisuutta, Pakkaus, No. 11/2006, Finland, 3 p.

[9]       Piili, H., Characterisation of interaction phenomena of laser beam and paper materials in cutting, Licentiate Thesis, Lappeenranta University of Technology, 2009, 258 p.

[10]      Malmberg, H., Kujanpää V., Paperimateriaalien laserleikkaus, Vol. 88, Paperi ja Puu, No. 8/2006, Finland, pp. 452-454.

[11]      Hovikorpi, J., Malmberg, H., Laakso, P., Kujanpää, V., Miikki, N., Kurittu, M., Laser cutting of paper, Proceedings of the 23rd International Congress on Applications of Lasers and Electro-Optics ICALEO 2004, October 4-7, 2004, San Francisco, USA, 11 p.

[12]      Boyle, E., Lasers are on the cutting edge, digitally speaking, Paper, film & foil converter, 1999, no. 4, pp. 14-15.

[13]      Malmberg, H., Leino, K., Kujanpää, V., Laser Cutting of Paper and Board (ILACPaper), Research Report 68, Department of Mechanical Engineering, Lappeenranta University of Technology, Finland, 2006, 344 p.

Author:

Mrs. Heidi Piili (previously Malmberg), M.Sc., Lic.Tech., has more than 7 years experience of laser processing of different materials at Laser Processing Research Group (LUT Laser) of Lappeenranta University of Technology (LUT). Her specialty field is laser processing of non-metallic materials. At the moment she is working as project manager in a project of laser processing of microscale process devices for chemical industry. She is a Doctoral student and will graduate within next couple of years.

The above brief overview was extracted from its original abstract and paper presented at The International Congress on Applications of Lasers & Electro-Optics (ICALEO) in Orlando, FL. To order a copy of the complete proceedings from this conference click here

Precision Cutting & Drilling Metals With a Fiber Laser Marker

By: Hong Q. Chen

Hongqiang Chen, Geoff Shannon
Miyachi Unitek Corporation
1820 S. Myrtle Ave, Monvoria, CA 91016, USA
Overview
Recently developed of pulsed fibre laser marking system is becoming a powerful tool for precision cutting and drilling. It can provide dimensional cut repeatability to sub 10 microns, cut or drill material up to 0.5mm with minimal to no burring, and offer multi axis motion options.
The material removal mechanism of the new process is vaporization cutting. In this process the solid material is vaporized without it passing through a liquid phase. Normally no gas assist is needed except for optics protection. By this means, short pulse lasers with high peak power can cut highly reflective metals such as copper and gold with a very small HAZ and burr.
A fibre laser marking system (LMF2000 marker from Miyachi Unitek) is selected for the study. A unique feature of this marker is the laser pulse shape: a high peak power short (20~30ns) pulse with a long (up to 300ns) flat tail. The high peak power helps achieve good coupling of the laser energy into work piece and the long tail region can provides great advantages for deep material penetration and fast removal rate. By optimizing the laser parameters, material can be removed a thin layer at a time with a high speed scan, the multiple passes helping to improve cut quality. The method uses no direct assist gas, and control of laser parameters allows the cut to be optimized to minimize the heat affected zone (HAZ), underside burr and, on small tubes, backside damage.
Copper and copper alloys have been developed for a wide variety of applications. Figure 1 shows the cutting result on a thin copper sheet. The customer designed butterfly pattern was directly imported to the marker software, to drive the scan head. Using optimized laser parameters clean, sharp edge cuts were achieved and the cycle time for the whole pattern was about 32s.
Laser drilling of micro holes is especially important in medical tool manufacturing. In addition to high speed trepanning a pulsed fibre marker in burst mode can percussion drill both through and blind holes; an attractive alternative to customized pulsed YAG laser drilling systems. Examples of hole drilling with the fibre marker are shown in figure 2.
Pulsed fibre laser markers that offer high peak power and pulse shape features, such as the LMF2000, show great potential for high quality precision cutting and drilling of both ferrous and highly reflective metals. This approach offers an extremely cost effective option to multi axis CNC laser cutting systems. Other benefits include a simple intuitive interface that directly imports files of many graphic formats.
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Figure 1: Laser cutting customer-designed pattern on 0.25 mm copper sheet
Figure 2: Laser hole drilling on SS304. (a) percussion drilling through 40 μm sheet (b) hole array machined in 0.4s thanks to the fast scan mirror beam control

The above brief overview was extracted from its original abstract and paper presented at The International Congress on Applications of Lasers & Electro-Optics (ICALEO) in Orlando, FL. To order a copy of the complete proceedings from this conference click here

Paper 1708