The latest LIA Today has been published and is now available online. If you have never read LIA Today we encourage you to flip open a few pages! Those of you who have read it in the past know what a great publication this is.If you would like to take a look you can find […]
Laser Insights
The Novel Technology for Thick Glass Cutting with Small Power Laser Saw
By Chao Huang, Jimin Chen and Shi bai Introduction In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In […]
High Density Through Glass Vias for Advanced Chip Packaging
By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative […]
LIA’s Medical LSO Courses To Feature Laser Demonstrations
ORLANDO, FL, Aug. 14, 2014 — In an effort to give students a first-hand experience with lasers in the operating room, the Laser Institute of America (LIA) is partnering with medical solutions provider Universal Hospital Services (UHS), through its UHS Surgical Services business unit, to offer laser demonstrations at LIA’s Medical Laser Safety Officer (MLSO) training […]
Laser Micro Welding of Aluminum with the Superposition of a Pulsed Diode Laser and a Pulsed Nd:Yag Laser
By Philipp von Witzendorff, Lorenz Gehrmann, Martin Bielenin, Jean-Pierre Bergmann, Stefan Kaierle and Ludger Overmeyer Pulsed laser welding is applied for welding of thin aluminum sheets when the heat affected zone has to be minimized. The pulsed laser process enables a low and precise heat input because the heat dissipates away in between the laser pulses. […]