Laser Joining for Packaging in MEMS Applications and Micro-Devices

By: Norbert Lorenz In recent years the interest in micro-devices, including Micro-Electro-Mechanical-Systems (MEMS), from research institutions, industry and the press has risen considerably. However one of the persisting challenges in the fabrication of such devices is the packaging process. A number of different bonding techniques have been developed but in general they require the entire […]

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