The Percussion Drilling of SI using a 20W MOPA Based YB Fiber Laser

By: Kun Li, William O’Neill, Jack Gabzdyl Institute for Manufacturing, University of Cambridge SPI Lasers The micro-machining of silicon components for use in the MEMS fabrication and microelectronics industry is well-established, and the demand for semiconductors started to recover after the 2008 downturn. Laser micro-drilled interconnect via holes is an application that has been applied […]

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