Category Archives: Laser Joining

Explore Laser Manufacturing Technology at the Lasers for Manufacturing Event

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ORLANDO, FL (March 19, 2018) – The Laser Institute of America is excited to announce that the 2018 Lasers for Manufacturing Event® (LME®) will be held at the Schaumburg Convention Center in Schaumburg, Illinois March 28-29. This year will be the first time the event will be co-located with the Laser Additive Manufacturing (LAM®) Conference, which takes place March 27-28.

LME offers an opportunity for anyone interested in using lasers in manufacturing to learn more about commercial applications and interact with companies that offer laser manufacturing solutions.

The event will feature about 60 exhibitors, including Amplitude, Ekspla, Light Conversion, Lumentum, SPI, Alabama Lasers, GF Machining Solutions, Hass Laser technologies, Lasea, Kentek, LPW Technology, and Powder Alloy Corporation.

LME is made possible by generous sponsors Han’s Laser, IPG Photonics, Laser Mechanisms and Trumpf. All four companies will have exhibit booths attendees can visit to learn more about the laser manufacturing solutions they provide.

On day one, keynote speaker Ron D. Schaeffer, a technical consultant for PhotoMachining, will give an overview on the industrial laser market, and host a tutorial on current trends in laser micromachining.

On the second day, Dr. Geoff Shannon from Amada Miyachi America will give his keynote address on lasers used for medical device manufacturing, and David Havrilla of Trumpf will present a tutorial on Laser Welding Techniques and Applications.

Throughout both days of the event, industry experts will host an ongoing series of laser introductory courses on the exhibit floor that will cover topics such as laser sources, beam delivery systems, laser safety, laser marking, laser cleaning, laser cutting, laser welding, laser cladding and optics.

An “Ask the Experts” booth will also be open both days on the exhibit floor. Organized by Directed Light Inc. President Neil Ball, this booth will have laser industry experts ready to help supply attendees with all the information they need to increase profits and efficiency and expand their businesses.

After gaining a world-class laser education from the exhibitors and experts, attendees can enjoy live laser demonstrations, tour the TRUMPF smart factory, and relax and mingle during the complimentary ice cream social and drink reception. All LME attendees will also be entered in a giveaway.

For more information, and to register for the event, visit www.laserevent.org.

 

About LIA

The Laser Institute of America (LIA) is the professional society for laser applications and safety serving the industrial, educational, medical, research and government communities throughout the world since 1968. www.lia.org, 13501 Ingenuity Drive, Suite 128, Orlando, FL 32826, +1.407.380.1553.

Local Laser Joining of Glass and Silicon

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By Assi Hansen, Isamu Miyamoto, Tiina Amberla, Yasuhiro Okamoto

One of the most employed material combinations in microtechnology is the glass-silicon pair. Since the huge growth of the microelectromechanical devices, sensors and micro-fluidic devices, bonding of this couple has become more and more critical issue. Many of these glass-silicon bonding processes, for example anodic bonding, fusion bonding and eutectic bonding, have reached their limits in terms of flexibility. In addition, high temperature and electrical field applied in the process can limit the application. Compared to conventional methods, local laser joining technique can provide many advantages, such as localized and flexible joining, non-contact manufacturing, high precision and repeatability, easiness and minimization of heat effects. The technique is based on the principle of transmission welding, where glass is transparent to the wavelength used and hence the laser beam passes through the glass wafer and is absorbed to silicon. As a result, silicon is melted and upon resolidification bonding is realized between the two substrates. Continue reading →

Laser Joining for Packaging in MEMS Applications and Micro-Devices

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By: Norbert Lorenz

In recent years the interest in micro-devices, including Micro-Electro-Mechanical-Systems (MEMS), from research institutions, industry and the press has risen considerably. However one of the persisting challenges in the fabrication of such devices is the packaging process. A number of different bonding techniques have been developed but in general they require the entire device to be heated to high temperatures. In particular for direct bonding techniques like Si-fusion and anodic bonding, temperatures in excess of 1000°C and strong electric fields (1000-2000 V) are essential for successful packaging. As a consequence the use of temperature-sensitive materials within the package is restricted and problems are generated in multi-stage packaging processes where several heating cycles are carried out in sequence; parts joined in an earlier heating step can disassemble in a later one. Furthermore it is clearly important that the package should not affect the performance of the device or cause any damage. Often hermetic and/or vacuum packaging is required which makes the process application specific and expensive. Therefore it can easily account for up to 50% of the overall device cost and can even reach as much as 90%.

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