Throwback Thursday: The Invention of The Laser Scalpel

Invented just over 50 years ago, the laser scalpel is used in an array of surgical procedures, across medical fields. A laser scalpel is typically either a CO2 laser or a excimer laser, depending on the surgery. For soft tissue procedures, such as removing a birthmark or teeth whitening, a CO2 laser is used. A C02 laser’s wavelength is absorbed by water, which allows the laser to vaporize the surrounding tissue with minimal damage inflicted. Bleeding, swelling, and chances for infection are greatly decreased in procedures performed by CO2 lasers, which led to their adoption in the fields of dermatology, dentistry, oncology and beyond.

The CO2 laser was initially developed in 1964 at Bell Laboratories. Through the decade, and into the 1970s, researchers took interest in the gas-based, manipulable laser and its potential medical applications. Until the early 1980s, the laser scalpel was used almost exclusively in academic medical settings due to its size and availability. Once smaller, more powerful lasers were made accessible, the CO2 laser scalpel found its way into most hospitals and specialist’s offices.

In the case of laser eye surgery, an excimer laser is the preferred tool for LASIK procedures. The excimer laser has a high ultraviolet output, making it a strong candidate for use in surgical procedures. Researchers at IBM’s T.J. Watson Research Center began looking at the excimer laser’s potential for use on biological materials in the early 1980s. The precise, neat incisions created by the excimer qualified it for use in the medical field, ultimately resulting in a patent. The larger size of the excimer laser scalpel hinders its utilization in a number of medical fields. However, as the necessary technology is developed, the equipment is scaling down to fit a multitude of purposes.

In just over half a century, the laser scalpel has evolved from a potential medical tool to an industry standard.  A push for more powerful, free electron lasers coupled with the push for smaller equipment will likely increase the utilization of the laser scalpel. In the very near future, laser technology will be used for as many internal procedures as it is currently used for external. With lasers already in use for clearing clogged arteries and oral surgery, the future of the laser in surgical procedures is closer than most of us realize.

High Density Through Glass Vias for Advanced Chip Packaging

By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune

Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative to polished thin wafers made of silicon. As thin glass is extremely brittle, micromachining to create through glass vias is particularly challenging and laser processing using deep UV excimer lasers at a wavelength of 193 nm and ultra-short pulse laser provide a viable solution. Continue reading

Laser Fabrication of Nanobump Arrays on Si Substrate Via Optical Near-Field Enhancement

By: X.C. Wang, H.Y. Zheng, C. W. Tan, F. Wang, H. Y. Yu, K. L. Pey

Singapore Institute of Manufacturing Technology (SIMTech), Singapore
School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore

Modern technology requires the ability of creating smaller and smaller devices. Whether it is for information storage, high definition displays or sensor arrays, there are increasing demands for techniques able to define features smaller than micrometers or even just a few nanometers across. Several technologies such as electron beam lithography, X-ray lithography, nanoimprinting, and optical near-field lithography etc, have widely been investigated for nanofabrication. However, they all have some disadvantages especially in terms of cost flexibility, and complexity. Electron beam lithography is characterized by low sample throughput, high sample cost, modest feature shape control and excellent feature size control, whereas x-ray lithography is characterized by initial high capital costs but high sample throughput. Conventional optical lithography is relatively cheap and adaptable, but, its minimum feature size is limited by optical diffraction.

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