Optimiztion of Laser Drilling in Ceramics

By: Yinzhou Yan

Laser drilling is commonly acknowledged as a hole fabricating technique especially for hard and brittle materials like advanced ceramics. Unfortunately, laser drilled hole are inherently associated with spatter deposition due to the incomplete expulsion of molten ejection from the hole, which enlarges the hole diameter and resolidifies on the workpiece surface around the hole periphery. This defect is more evident in laser percussion drilling thick ceramics that has a high melting boiling point. It causes a low quality of drilled hole and needs a long pre-cutting path in laser cutting to avoid spatter depositing on the cutting path. In our current study, the behaviors of debris and hole diameter in CO2 laser percussion drilling of 95 % alumina ceramic sheets (4.4 mm thick) under different processing parameters were investigated to figure out the effect of main energetic processing parameters on these behaviors. The corresponding processing parameters include laser peck power, pulse duty cycle, pulse repetition frequency and piercing time. The change trend curves of debris and hole diameter with the related parameters were plotted respectively. The combined effects of these parameters were also studied in our work, such as the co-action of peak power and pulse duty cycle, the co-action of peak power and piercing time, the co-action of pulse repetition frequency and piercing time, the co-action of pulse duty cycle and piercing time, and the co-action of pulse duty cycle, pulse repetition frequency and piercing time. The potential mechanism of individual parameter affected on material removal during laser percussion drilling was also discussed based on the experimental result.

The obtained result shows that (1) Laser peak power affected vaporization rate. (2) Pulse duty cycle influenced melt rate. (3) Pulse frequency affected valid heating efficiency in workpiece. Higher pulse frequency caused the debris and hole diameter decreased, and resulted in more symmetrical spatter deposition which contributed to the perfect circularity of the drilled holes. (4) Piercing time influenced drilled depth before entire beam break-through. With increasing peak power, pulse duty cycle or pulse frequency, the piercing time for a complete through-hole could be shorten. (5) On the process qualities (debris and hole diameter), peak power and pulse duty cycle had significant effects, pulse frequency had a lower effect, while piercing time had the lowest effect. Comparatively, peak power had a more significant effect than pulse duty cycle on spatter formation.

From our research, the effects of different processing parameters on quality of laser drilled hole in alumina ceramics were observed. The processing parameters could be further optimized to achieve less debris and finer hole drilling by some basic conclusions from our work. The possibility of controlling debris and hole diameter also leads to numerous benefits especially during closely spaced array laser drilling or short per-cutting path laser cutting for efficiency improvements. Moreover, the method referred in the work is also suitable for studying other materials drilled by laser, which could help technicians optimize processing parameters more effectively.

The above brief overview was extracted from its original abstract and paper presented at The International Congress on Applications of Lasers & Electro-Optics (ICALEO) in Orlando, FL. To order a copy of the complete proceedings from this conference click here

High Rate Laser Drilling And Texturing of Silicon

By: Henrikki Pantsar1, Tim Lauterborn1, Annerose Knorz2, Hans Herfurth1, Stefan Heinemann1

1 Fraunhofer USA, Center for Laser Technlogy,

46025 Port Street, Plymouth, MI 48170

2Fraunhofer Institute for Solar Energy Systems

Heidenhofstrasse 2, 79110 Freiburg, Germany

The greatest challenge for photovoltaic solar cells is to reduce the price per watt for terrestrial applications. In silicon panel production this can be accomplished by economies of scale, developing automation, improving cell efficiency and reducing material costs either by using thinner wafers and/or lower-quality materials. Larger, thinner substrates enable processing of more active area per step and reduce the consumption of material per cell. Back contact solar cell concepts such as the Emitter Wrap Through (EWT) adapt well to these requirements. The respective challenge in manufacturing these cells is the large number of through holes that are needed per cell. One cell can comprise up to 25,000 holes.

Due to the required cycle times drilling techniques such as percussion drilling are not fast enough for production. In order to reach highest possible drilling rates high rate drilling techniques, such as using a scanner with pulse synchronization are needed. This processing strategy allows high beam duty cycles and thus faster processing times. The drilling process has to be optimized to reach best material removal efficiency. In this aspect MOPA fiber lasers have shown to be efficient tools due to their property of allowing independent adjustment of pulse parameter such as pulse width and frequency.

The Center for Laser Technology of Fraunhofer USA, Inc. in Plymouth, MI has developed laser-based techniques for texturing and drilling Si-wafers at extremely high rates using MOPA fiber lasers. Contrary to q-switched lasers, the pulse parameters; pulse energy, pulse width and pulse frequency can be adjusted independently opening a parameter space in which the process can be optimized for specific process or material. Drilling efficiencies of 150 holes per Joule have been demonstrated in 200 μm silicon wafers using process-optimized pulse parameters. Using a 5 W average power a number of approximately 800 holes per second were drilled. The results have been published in the Proceedings of the ICALEO 2009 conference held in Orlando, Fl. Since then, the process has been demonstrated using 20 W laser power reaching more than 3,100 holes per second. The high drilling rate is based on pulse parameter optimization and a unique FPGA based pulse synchronization controller. Further improvement in drilling rates is yet expected with manipulating the pulse shape.

The above brief overview was extracted from its original abstract and paper presented at The International Congress on Applications of Lasers & Electro-Optics (ICALEO) in Orlando, FL. To order a copy of the complete proceedings from this conference click here

Paper 1104