September’s Featured Corporate Member – Wayne Trail, A Lincoln Electric Company

Wayne Trail, a subsidiary of Lincoln Electric, is a leader in the design of flexible, automated systems utilized within a wide range of metal forming, fabricating and joining industries. Its current market segments include robotics, welding and fixturing; press automation; tube bending and fabricating systems; tubular hydroform and structural frame automation; build-to-print manufacturing services; and laser processing systems.

At the time of Wayne Trail’s inception, the company provided the Dayton, Ohio-region automotive industry with tools, dies and fixtures. The company’s reputation and customer base grew throughout the years, allowing for the development of its engineering expertise and inclusion of automation through the production of automated tube-bending systems. In addition, Wayne Trail acquired companies, such as Livernois Press Automation, Flexible Systems Engineering and VIL Laser Systems, which added to its visibility within the industry, expanding its capabilities and, ultimately, leading to its acquisition by Lincoln Electric in 2012.

Since then, Wayne Trail has added to Lincoln Electric’s strength by not only incorporating the staff’s experience in design and system building, but also in adding their proven capabilities and success in laser welding systems. Lincoln Electric employs over 10,000 people globally among their 49 manufacturing operations, joint ventures and alliances in 19 countries, with 180 employees located at the Wayne Trail facility. As laser experts, Wayne Trail has added to Lincoln Electric’s vast product line for numerous industries and products, such as automotive and specialty powertrain component systems and both standard- and custom-designed cells for laser welding, cutting, brazing and more.

Despite its numerous innovative offerings, Wayne Trail’s laser welding system services prove among its most important. From the automotive and aerospace sectors to the battery and energy sectors, Wayne Trail continuously meets new challenges through their powertrain laser systems, multiple robotic laser cutting systems, laser ablation and brazing systems. The company adds to Lincoln Electric’s history as a leading global innovator, continuing to invest in research and development of laser processes – including brazing, ablation, laser die cleaning and laser/hot wire for cladding and welding applications – which hold the potential to help move technology further around the globe.

Over the last five years, Lincoln Electric has grown in automotive, aerospace and commercial system applications for multi-axis laser processing. Continued development in technology and the increase in reliability has allowed lasers to venture from the lab into real-world production systems. As lasers continue to prove themselves as a reliable method of joining and cutting of numerous materials within the industry, immense growth has occurred, creating new jobs and allowing for Lincoln Electric’s expansion into other areas of automation requirements.

With the availability of new materials and affordability of laser technology for customers, Lincoln Electric continues to weld, clean, cut and drill complex components for customers. To meet customers’ developing demands, Lincoln Electric’s engineering groups remain dedicated to developing and advancing innovative system concepts and tools. This was seen when Wayne Trail R&D engineers raised deposition rates and eliminated waste powder while using powder systems through the development of a hot wire process.

As a member of Laser Institute of America (LIA) since 1995, Wayne Trail has been able to maintain access to information and opportunities that span all laser-related industries. It has also allowed the company to collaborate and contribute to the industries it supports, through a presence at LIA conferences and expos, while also keeping Lincoln Electric close to the industry and helping it witness the growth of the laser.

For more information, visit www.waynetrail.com.

Drilling of Cooling Holes by Using High-Power Ultrashort Pulsed Laser Radiation

By Hermann Uchtmann

One of the main applications for laser drilling is the manufacturing of cooling holes with diameters of e.g., 500 µm in turbine components such as turbine blades and vanes or combustion chambers. Nowadays, these cooling holes are drilled by using flash lamp pumped Nd:YAG laser radiation and partially by using QCW fiber laser radiation with pulse durations in the range of 200 µs up to a few ms. The main deficit of these conventional technologies is the appearance of recast layers with thicknesses up to a few 100 µm at the hole wall. These recast layers arise due to the melt-dominated drilling process. During operation of the drilled components, the recast layers can chip off or can be the initial point for cracks. Both effects lead to a shorter lifetime of the component. Continue reading

The Novel Technology for Thick Glass Cutting with Small Power Laser Saw

By Chao Huang, Jimin Chen and Shi bai

Introduction

In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In this study, we developed a so called “laser saw” technology. With this technology, the laser power for cutting thick glass could be significantly decreased. Not only can it cut irregular shape but also it can realize sloped cutting which means the cutting section is not perpendicular to the glass surface. Continue reading

Real-Time Control of Polarization in High-Aspect-Ratio Ultra-Short-Pulse Laser Micro-Machining

By: O. J. Allegre, W. Perrie, K. Bauchert, G. Dearden, K. G. Watkins

Laser Group, School of Engineering, University of Liverpool, UK
Boulder Nonlinear Systems, Inc., Colorado

The past decade has seen the development of ultra-short pulse lasers, with processes based on femtosecond and picosecond pulse durations becoming increasingly widespread. Thanks to the ultra-short timescale on which laser energy is coupled to the material, high precision machining of metals has been achieved with very little thermal damage. Industrial applications include the very precise drilling of holes for fuel-injection nozzles in the automotive industry. Polarization plays a particularly important role in drilling high-aspect-ratio (depth/diameter) microscopic holes in metal. Drilling with a linear polarized laser beam produces distorted hole profiles due to the anisotropic reflectivity of linear polarization. This paper describes the use of a liquid-crystal polarization rotator developed by Boulder Nonlinear Systems, Inc. to improve drilling quality by removing the distortions associated with static linear polarization. This flexible device allows rapid switching of the linear polarization of a laser beam between two orthogonal directions during micro-drilling. As a proof of principle, helical drilling tests were performed on stainless steel, using a 775 nm, 200 femtosecond pulse laser.

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The Percussion Drilling of SI using a 20W MOPA Based YB Fiber Laser

By: Kun Li, William O’Neill, Jack Gabzdyl

Institute for Manufacturing, University of Cambridge
SPI Lasers

The micro-machining of silicon components for use in the MEMS fabrication and microelectronics industry is well-established, and the demand for semiconductors started to recover after the 2008 downturn. Laser micro-drilled interconnect via holes is an application that has been applied in high volume manufacturing since 1995. In 2006, the laser held 70% of the microvia market because of its broad processing capabilities with a wide range of materials. Meanwhile the photovoltaic (PV) industry has experienced enormous growth over last few years, and it forecasts to grow to $100 billion between 2008 and 2013 (Lux Research, NY). As the most important material, c-Silicon has 77% of market share of world production of solar cells NanoMarket web (2009). Additionally, many novel high efficiency solar cell concepts (Emitter Wrap Through & Metal Wrap Through) are only feasible with laser technology, since it satisfies the requirement of drilling a few thousand holes (50-100µm in diameter) per second in c-Si.

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