ORLANDO, FL, Nov. 18, 2014 — Back by popular demand, Laser Institute of America (LIA) is excited to announce that the American National Standards Institute (ANSI) Z136 series of laser safety standards are once again available in digital format. No longer bound to only a hard copy, customers can now enjoy the flexibility of […]
Author: Steven Glover
Steven Glover is a proud member of the LIA staff. When he is not at work he is actively involved in several charitable efforts.Advanced Laser Applications Presented at ICALEO 2014
ORLANDO, FL, Nov. 10, 2014 — A new peer-review process for select presentations and a host of novel laser research expanded on the tradition and impact of 33rd installment of the Laser Institute of America’s flagship conference in San Diego on Oct. 19-23. The International Congress on Applications of Lasers & Electro-Optics (ICALEO®) featured 56 […]
LME 2014 Showcases Global Opportunities for Laser Manufacturing Processes
By Geoff Giordano Sapphire cutting for electronic displays, laser marking and processes related to retrieving and transporting oil, were among the leading applications spotlighted at LIA’s fourth Lasers for Manufacturing Event® (LME®) on Sept. 23-24 at the Schaumburg (IL) Convention Center. Attendees packed 101-level courses on laser types, laser welding, cost advantages of lasers and […]
Introduction to Laser Micromanufacturing
By Ronald D. Schaeffer Laser micromanufacturing is just like traditional manufacturing except that we use photons (light!) instead of, for instance, drill bits and saw blades. Lasers are used for machining, marking, welding and surface treatment. This article provides a brief summary of how lasers are used in several exemplary situations. In conclusion, a discussion […]
Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
By Christian Fornaroli Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but […]