Category Archives: Featured

The Laser Institute (LIA) Announces Retirement of Executive Director

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Orlando, FL – 3/28/23

The Laser Institute, a nonprofit organization that promotes laser safety and education, announced that Dr. Nathaniel Quick has retired from his Executive Director position, effective February 28, 2023. LIA’s President Henrikki Pantsar says, “The organization has been managed by Executive Director Dr. Nat Quick for the past five years, and it is due to his leadership and the tireless work of the LIA Staff that we are in this position to look for further growth. Therefore, it is with sadness that I announce the retirement of Nat from his position as the Executive Director. But it is also my pleasure to announce Nat’s retirement, as we know that it will allow him to enjoy other aspects of his life, enjoy time with his family and relax after spending a majority of his life in management and executive positions, as an entrepreneur, and most recently guiding our Laser Institute of America.”

Dr. Quick has been an integral part of LIA, bringing his expertise and vision to help the organization grow and achieve success. “We are extremely grateful for Nat’s service to the LIA and to his leadership filled with hard work, passion and integrity,” says Henrikki Pantsar.

While announcing his retirement, Dr. Quick had this to say, “I will miss being a part of the day-to-day operations of LIA and its staff, but look forward to providing support and advice when and where needed. It has been an honor and privilege to serve. I will forever be grateful for my time at LIA and the memories I have made there. Thank you to all who have supported me along this journey.”

The LIA would like to thank Dr. Quick for his hard work, dedication, and commitment to the organization and wishes him all the best in his retirement.

LIA has begun the search for a new executive director and is committed to finding the best candidate to lead the organization into its next chapter. If you know someone who would be interested in the position, the posting can be found at www.lia.org/ed-application

Dr. Bo Gu – 2022 Schawlow Award Recipient

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ORLANDO, FL – September 22, 2022 — Laser Institute of America (LIA) Fellow, LIA Board officer Dr. Bo Gu has been selected as the 2022 Arthur L. Schawlow Award recipient in recognition to his career long contributions throughout the laser industry in the fields of micro- and nano engineering and laser applications in industrial metal processing.

With over 35 years in the laser material processing field, Dr. Bo Gu has built a reputable career which includes developing Asian and Chinese markets during his time as the Director of Asia operations and GM of IPG China. He has not only worked with IPG but for GSI group but has helped advance the laser industry with his collaborative spirit and willingness to mentor young professionals. Dr. Bo Gu continues to help professionals further their careers through his teachings including several educational courses on laser applications.

Dr. Bo Gu has had a successful research and development career and continues his contributions to the industry with the founding of BOS Photonics which specializes in photonic technologies and consulting photonic companies. He holds 75 patents on lasers and their applications and holds positions such as committee member of LIA and international advisor. One of Dr. Gu’s latest achievements is contributing to the published Handbook of Laser Micro- and Nano-Engineering as a co-author in December 2021.

When notified of his receiving this award, Dr. Bo Gu stated, “I would like to thank LIA for this prestigious award. It is a lofty honor for me. It is not only an affirmation of my 40 year long professional career in lasers, but also represents and witnesses the development of laser technology and its applications. Through my winning of this renowned award that bears the name of a great laser physicist, I hope the laser technology can be promoted to a higher level by combining it with some of the emerging technologies such as artificial intelligence and big data, and to be applied to a wider range of fields for the benefit of mankind.”

The purpose of the Schawlow award is recognize outstanding, career-long contributions to basic and applied research in laser science and engineering leading to fundamental understanding of laser materials interaction and/or transfer of laser technology for increased application in industry, medicine and daily life. Originally named after it’s first recipient Dr. Arthur Schawlow in 1982 and throughout the years many more distinguished individuals have received this honor.

Executive Director of LIA, Dr. Nathaniel Quick stated, “The selection of Dr. Bo Gu as the 2022 Schawlow award is an excellent choice. Dr. Gu’s name certainly belongs alongside the names of previous recipients.”

The Schawlow award will be presented to Dr. Bo Gu at this year’s International Congress on Applications of Lasers & Electro-Optics (ICALEO) conference which takes place in Orlando, Florida this October 17th – 20, 2022.

About LIA
The Laser Institute of America (LIA) is the professional society for laser applications and safety serving the industrial, educational, medical, research and government communities throughout the world since
1968. www.lia.org, 12001 Research Parkway, Ste 210, Orlando, FL 32826, +1.407.380.1553

The Novel Technology for Thick Glass Cutting with Small Power Laser Saw

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By Chao Huang, Jimin Chen and Shi bai

Introduction

In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In this study, we developed a so called “laser saw” technology. With this technology, the laser power for cutting thick glass could be significantly decreased. Not only can it cut irregular shape but also it can realize sloped cutting which means the cutting section is not perpendicular to the glass surface. Continue reading →

High Density Through Glass Vias for Advanced Chip Packaging

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By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune

Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative to polished thin wafers made of silicon. As thin glass is extremely brittle, micromachining to create through glass vias is particularly challenging and laser processing using deep UV excimer lasers at a wavelength of 193 nm and ultra-short pulse laser provide a viable solution. Continue reading →