Tag Archives: Laser Cutting

ICALEO 2014 Offered Attendees a Full Spectrum of Laser Possibilities

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By Geoff Giordano 

Not resting on the laurels of its flagship conference, the Laser Institute of America instituted a peer-review process for its 33rd International Congress on Applications of Lasers & Electro-Optics (ICALEO®), held Oct. 19-23 in San Diego.

For the first time, ICALEO featured presentations given even more rigorous analysis than previous events; 56 of the 61 papers submitted for peer review were accepted. “It was quite a bit of a challenge” reviewing abstracts, said returning Congress General Chair Stefan Kaierle of Laser Zentrum Hannover. “We believe it was necessary… to change the way we present our work and especially to improve the quality.” At least two people reviewed each paper in the double-blind process. About 35 to 40 papers will be published in a special edition of the Journal of Laser Applications® (JLA), he said.

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Advanced Laser Applications Presented at ICALEO 2014

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ORLANDO, FL, Nov. 10, 2014 — A new peer-review process for select presentations and a host of novel laser research expanded on the tradition and impact of 33rd installment of the Laser Institute of America’s flagship conference in San Diego on Oct. 19-23.

The International Congress on Applications of Lasers & Electro-Optics (ICALEO®) featured 56 presentations given at least two reviews in a double-blind process, said returning General Chair Stefan Kaierle of Laser Zentrum Hanover. “We believe it was necessary… to change the way we present our work and especially to improve the quality.” About 35 to 40 papers will be published in a special edition of the Journal of Laser Applications, he said.

ICALEO featured another smorgasbord of laser research and experimentation spanning the traditional and the novel — from 3D printing of human cells and killing malaria-carrying mosquitoes to powering a small flying craft and improving the dyeing and patterning of textiles. Continue reading →

Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process

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By Christian Fornaroli

Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but as the wafer material gets thinner and the chip size smaller, this classical process can be replaced by laser-based dicing processes. In particular, the mechanical load and the relatively large kerf width are serious disadvantages of a mechanical dicing process. A reduction of the kerf width leads to a much higher yield of chips per wafer and, therefore, to increasing efficiency and conserving resources at the same time.

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What You Missed at LIA’s Lasers for Manufacturing Event and Summit 2014

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ORLANDO, FL, Oct. 17, 2014 — The fourth annual LME was another exciting event full of informative educational courses and laser vendors with offerings on a wide range of laser related products. Laser experts, business professionals and representatives of the industry curious about laser manufacturing gathered for LME 2014 at the Schaumburg Convention Center in Schaumburg, IL from Sept. 23 -24, 2014.

This year’s LME expanded on exhibit space and hosted an increased number of exhibiting companies from last year. Follow updates for the upcoming LME at www.laserevent.org.

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The Novel Technology for Thick Glass Cutting with Small Power Laser Saw

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By Chao Huang, Jimin Chen and Shi bai

Introduction

In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In this study, we developed a so called “laser saw” technology. With this technology, the laser power for cutting thick glass could be significantly decreased. Not only can it cut irregular shape but also it can realize sloped cutting which means the cutting section is not perpendicular to the glass surface. Continue reading →