Tag Archives: Ultrashort Pulse Laser

Clark-MXR, Inc. – July’s Featured Corporate Member

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An industry leader in Ultrashort Pulse laser based micromachining and the production of ultrafast lasers and laser-based solutions for scientific research and industrial applications, Clark-MXR, Inc. is known for offering unparalleled contract manufacturing services and easy-to-use laser products at a low cost of ownership. Located in Dexter, Michigan, Clark-MXR, Inc. serves customers from universities, laboratories and industries across the globe.

Clark-MXR, Inc. was incorporated as a Michigan corporation in 1992, to acquire the assets of two running companies: Clark Instrumentation Inc., founded by Dr. William Clark, and Medox (MXR) Research, Inc., founded by Dr. Philippe Bado – a member of Professor Gerard Mourou’s research group. As the world’s first commercial ultrafast laser company, Clark-MXR, Inc. has introduced many first-to-the-market products since its inception, including its CPA-1000 in 1992. In addition, Clark-MXR, Inc. has been involved in the use of ultrafast lasers for micromachining based on research conducted at Professor Mourou’s laboratory at the University of Michigan.

The company’s products and services stem from its two main divisions: the Laser Products Division and the Micromachining Division. Responsible for designing, building and servicing ultrashort pulse lasers for scientific and industrial applications, the Laser Products Division also manufactures micromachining workstations that are used in industrial micromachining, micro-manufacturing and proof-of-concept process development. Its complete system solutions meet a variety of industry needs, from ultrashort pulse micromachining workstations based on Model CPA-Series Ti:Sapphire lasers to Model IMPULSE, Yb-doped fiber lasers and complete nonlinear spectroscopy systems. Additionally, this division of Clark-MXR, Inc. produces accessories, such as NOPAs and harmonic generators, and offers customized product development, consultation and collaborations.

The formation of the second division, the Micromachining Division, was initiated by the introduction and success of the first commercial ultrafast laser based micromachining workstation in 2002, Model UMW based on Model CPA-Series laser. Providing value-added service to the semiconductor, medical and other high tech industries, this division utilizes the company’s ultrashort pulse lasers to cover a range of tasks, from prototyping to routine part production.

The Micromachining Division consistently meets its goal of addressing the growing demand for micromachined parts using ultrafast lasers, which offer a superior quality when compared to traditional methods. Because of the company’s innovative technology and extensive knowledge from the last 20 years, Clark-MXR, Inc. can machine a wide variety of materials – including ceramics and refractory metals – without recasting, heat-affected-zone (HAZ), delamination or melting. The micromachining technologies utilized within this division of the company can be adapted for innovative research – from 3D tomography and geological sample analysis to laser ablation mass spectrometry and LIBS. With a clearly-honed expertise, state-of-the-art inspection facilities, and a dedication to working closely with customers, Clark-MXR, Inc. develops custom methodologies that successfully fulfill customers’ unique needs.

Over its history, Clark-MXR, Inc. has grown, now earning recognition as a premier company in the laser industry for ultrafast laser micromachining and for its numerous ultrafast laser products, including many first-to-market products and innovations. The range of products and services the company offers today includes Model CPA-Series Ti:Sapphire Ultrafast lasers, Model IMPULSE Yb-doped high power/high energy fiber lasers, Ultrafast Micromachining workstations,  and complete system solutions for micromachining and research sectors, including fully customized systems. In addition to its range of products, Clark-MXR, Inc. works to help the growing ultrafast laser based micromachining industry, among other things, through its Ultrafast Micromachining Handbook, which was introduced in 1999 and is now freely available on the Clark-MXR, Inc. website to familiarize individuals with the novel physics of ultrafast laser based material removal processes.

Since joining Laser Institute of America (LIA) in 1999, Clark-MXR, Inc. and its team have been actively involved in the organization, with Dr. William Clark serving as LIA president in 2005.

For more information, visit www.cmxr.com.

Drilling of Cooling Holes by Using High-Power Ultrashort Pulsed Laser Radiation

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By Hermann Uchtmann

One of the main applications for laser drilling is the manufacturing of cooling holes with diameters of e.g., 500 µm in turbine components such as turbine blades and vanes or combustion chambers. Nowadays, these cooling holes are drilled by using flash lamp pumped Nd:YAG laser radiation and partially by using QCW fiber laser radiation with pulse durations in the range of 200 µs up to a few ms. The main deficit of these conventional technologies is the appearance of recast layers with thicknesses up to a few 100 µm at the hole wall. These recast layers arise due to the melt-dominated drilling process. During operation of the drilled components, the recast layers can chip off or can be the initial point for cracks. Both effects lead to a shorter lifetime of the component. Continue reading →

Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process

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By Christian Fornaroli

Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but as the wafer material gets thinner and the chip size smaller, this classical process can be replaced by laser-based dicing processes. In particular, the mechanical load and the relatively large kerf width are serious disadvantages of a mechanical dicing process. A reduction of the kerf width leads to a much higher yield of chips per wafer and, therefore, to increasing efficiency and conserving resources at the same time.

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3D Surface Texturing Technology Using Ultrashort Pulsed Lasers

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By Max Groenendijk

Ultrashort pulsed lasers have proven to be excellent tools to fabricate micro and nanotextured surfaces. These surfaces have a high potential for several applications where the tiny surface textures can improve or add a specific functional property. It was at ICALEO® 2006 that we first demonstrated a super hydrophobic surface obtained by texturing using a femtosecond pulsed laser. However, the capabilities were limited to small and flat surfaces. In order to be able to introduce this technology in industrial applications Lightmotif developed a 3D capable machine. At ICALEO 2012 results obtained on real 3D curved parts were presented, bringing this innovative technology closer to the market.

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Micro-Hole Drilling on Cemented Tungsten Carbide by Ultra Short Laser Pulses

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By: Khai Pham Xuan, Kazuya Saginawa, Rie Tanabe, Yoshiro Ito

Department of Mechanical Engineering, Nagaoka University of Technology

Recently, high precision molds for small products are being highly required in many industrial applications, especially in information communication technology. Mold materials with high hardness, such like cemented tungsten carbide (WC-Co), are difficult to machine by classical chip-removal techniques and the electrical discharge machining (EDM) is mainly used technology in microfabrication of hard materials. Even though the accuracy of EDM is fairly high K.H. Ho and S.T. Newmann, State of the art electrical discharge machining (EDM), it has several drawbacks  such as slow machining rate and the additional time and cost needed for polishing and finishing processes. Recently, laser machining becomes an effective technique for machining of hard materials. Many experimental results show that short pulse laser machining allows removal of very small amount of material with little heat affected zone compared with nanosecond or longer pulse lasers.

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